Lamborghini Squadra Corse partners with HP Composites
HP will provide for engineering services and tooling, as well as equipment and components for Lamborghini’s competition cars.
Lamborghini Squadra Corse (Sant'Agata Bolognese, Italy) and HP Composites (Ascoli Piceno, Italy), Ascoli's leading company in the production of carbon fiber products, announced April 10 they have signed a strategic partnership agreement that will connect the two companies up to 2020.
HP will provide for engineering services and tooling, as well as equipment and components for Lamborghini’s competition cars. The collaboration comes to life on the tracks of the major championships around the world, where Lamborghini is busy with the Huràcan GT3. The bodywork components and the aerodynamic kits for all cars in the category are made entirely of carbon fiber in HP Composites’ Ascoli Piceno plants.
General manager of HP Composites Abramo Levato says, “We are proud and really happy to be able to support a key player like Lamborghini in this path."
In the current season, the Huràcan GT3 has collected 2 important victories in the American IMSA championship: the 24 hours of Daytona and the 12 hours of Sebring in the GTD category. The collaboration will also be a factor in the Lamborghini Super Trofeo single-brand championship which takes place on April 21-22 at Monza.
Related Content
-
Toray rCF from Boeing 787 is incorporated into ultra-light laptops
Torayca-based aerospace components have successfully been repurposed into the Lenovo ThinkPad X1 Carbon Gen 12, highlighting the ongoing application of recycled composites.
-
Time Bicycles to modernize composite bicycle manufacturing
With the aid of KraussMaffei, Clemson University and SC Fraunhofer USA Alliance, Time anticipates a transition to HP-RTM for more efficient carbon fiber bike frame manufacture, plus a new facility in South Carolina.
-
Carbon Mobile carbon fiber powers handheld gaming platform
HyRECM technology effectively stabilizes carbon fiber’s electrical and antenna properties, enabling development of next-gen electronics, such as the Snapdragon G3x Gen 2.