RTM
Huntsman researching opportunities for graphene-enhanced nanocomposites
The company is working on incorporating graphene into its Araldite epoxy resins.
Read MoreCAMX 2016 Exhibitor Previews: Part 1
CAMX, in its third year, is growing and expanding, and the quantity and quality of new products and technologies being introduced at the show is impressive. This week features Part 1 of the CAMX 2016 Exhibitor Previews.
Read MoreThe steadily growing list of IACMI resources
IACMI, the public-private composites consortium, is a little more than a year old and already has developed a strong collection of partnerships, facilities, equipment, software and material designed to help accelerate new technology development for the composites industry.
Read MoreSandwich structure makes hangars possible
Greek company Dasyc has developed the high-strength Composite Modular Transportable Hangar (CMTH), which uses interlocked composite sandwich panels to ease assembly and disassembly.
Read MoreHighlights from 10th Intl. CFK Valley Stade Convention 2016
Annual conference featured new carbon composite technologies.
Read MoreHuntsman, Acciona collaborate on all-composite lighthouse
The first-ever all-composite lighthouse is now installed at the port of Valencia in Spain.
Read MoreGetting real: Thermoplastic resin transfer molding
KraussMaffei is launching this fall thermoplastic resin transfer molding (T-RTM), through which caprolactam is injected into a preform and then in-mold polymerized to create polyamide 6.
Read MoreAn FRP facelift
When the University of Valencia's business school expanded its facilities, it turned to fire-rated composite structures to fabricate the 7000-sq-m of façade used to help modernize the structures.
Read MoreFine-tuning fiberglass: Smart fiber sizing
Some insights into those proprietary chemistries that can customize performance at the fiber/resin interface.
Read MorePixelated temperature control
Surface Generation is providing digital process control for composites molding that cuts energy use, cycle time and processing pressures while breaking boundaries in thickness, complexity and embedded elements.
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